A heatsink is a general term for a series of devices that conduct and dissipate heat. The temperature of equipment can be reduced by improving the transfer of heat across the solid-air boundary to the cooler ambient air.

A well-designed heatsink assembly can lower device temperatures by optimizing the heat dissipation path, creating a larger surface area on the heat-generating component to more effectively transfer and dissipate heat into the surrounding environment.

The semiconductor cooling module, commonly used in medical and aesthetic equipment, operates on the technical principle of a thermoelectric cooling system formed by adding heat dissipation structures to both sides of a semiconductor cooling chip (TEC). Finned structures on both sides of the TEC increase the convective heat exchange area.

Through convective heat exchange, the cooling capacity of the cold side exchanges heat with the air in the space being cooled, while simultaneously, the heat from the hot side of the TEC is exchanged with the air, promptly dissipating it into the environment.

 Common methods to lower the temperature of the hot side include passive cooling, liquid cooling, forced air cooling, and latent heat vacuum cooling. How to Improve the Efficiency of Semiconductor Cooling Modules 

1. Increase the Surface Area of the Heatsink Increasing the surface area involves appropriately enlarging the heat dissipation area within the same space. New process designs achieve this by reducing fin thickness and increasing fin density to enhance the surface area.

2. Improve Convective Heat Transfer Efficiency The heat transfer efficiency can be improved by increasing the surface airflow velocity of the heatsink assembly. This is optimized by reducing air resistance and utilizing effects like drawing in cold air through gaps to enhance cooling performance.

3. Enhance Thermal Conductivity and Heat Conduction To improve conductive heat transfer, using high-thermal-conductivity thermal interface materials can optimize the thermal spreading resistance of the heatsink assembly, thereby boosting its cooling capacity. In high heat flux scenarios, embedding heat pipes or vapor chambers into the base of the heatsink can effectively reduce spreading resistance and optimize heat dissipation.

4. Increase Radiative Heat Transfer Rate Besides selecting materials with good thermal conductivity, choosing appropriate surface treatments is also crucial. Common surface treatment methods include painting, sandblasting to increase roughness, anodizing, and plating.

5. Flexibly Select Different Specifications of Semiconductor Cooling Chips The cooling capacity of a semiconductor cooling chip varies depending on the number of thermoelectric couples, current, voltage, etc. In practical applications, different specifications of TECs can be flexibly selected based on specific requirements.

Huajing Thermal Control - Custom Semiconductor Cooling Modules for Medical Aesthetic Equipment Huajing Thermal Control's semiconductor cooling modules are heat dissipation assemblies that combine thermoelectric cooling with technologies like air cooling and water cooling. They offer technical advantages such as greater adaptability to environmental conditions, long service life, and reliable, stable performance.

Huajing Thermal Control has an R&D team composed of experts in thermal management research and semiconductor cooling technology development.

With extensive design experience and advanced design concepts for semiconductor cooling modules, we can provide optimal heatsink solutions based on the product's heat generation mechanism, considering economic rationality, technical feasibility, and practicality.

 We customize semiconductor cooling modules for medical aesthetic equipment clients.

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