Requiring no liquid nitrogen or heating rods, low-temperature experimental instruments adopt miniature semiconductor refrigeration chips, enabling experimental samples to achieve rapid cooling and heating switching within a wide temperature range of -50℃ to +80℃, with a temperature control accuracy as high as 0.01℃.

The core principle of semiconductor refrigeration is the thermoelectric effect, which transfers heat through microscopic electron movement to realize high-precision, bidirectional and non-lag temperature control. A semiconductor refrigeration chip consists of dozens of thermocouple pairs sandwiched between ceramic plates. When electrified, it forms cold and hot sides, providing physical support for the bidirectional temperature control of equipment.

TEC (Thermoelectric Cooler) has remarkable advantages over traditional temperature control technologies. Compressor refrigeration is unidirectional and requires an external electric heating wire for heating, leading to mechanical hysteresis during mode switching. In contrast, TEC can instantly switch the cold and hot sides by reversing the current, with no mechanical delay or inertial waiting.

Full Temperature Range Coverage Realized by Multi-stage Cascade and Bidirectional Drive

The ultra-wide temperature regulation range of -50℃ to +80℃ of the equipment is mainly realized through multi-stage cascade connection and bidirectional current drive technology of semiconductor refrigeration chips, which effectively breaks the temperature control limitations of single-stage TEC.

Breaking the temperature control limit of single-stage TEC: Under standard working conditions (hot side temperature at 27℃), the maximum temperature difference (ΔTmax) of a single-stage TEC is approximately 67℃, with a theoretical minimum temperature of -40℃. However, such extreme working conditions feature low efficiency and poor stability, failing to meet the requirements of high-precision experiments.

Two-stage or three-stage TEC stacking and cascade connection enables relay refrigeration: the upper-stage TEC cools the hot side of the lower-stage one, and the cold side of the final stage serves as the experimental platform. This stably achieves ultra-low temperatures below -60℃ while keeping all module stages operating in an efficient range.

Second-level cold-heat mode switching: When heating up to +80℃, the controller reverses the TEC current to synchronously switch the cold and hot sides. Combined with precise PID closed-loop control, the switching process features no dead zone, no temperature overshoot and extremely fast response.

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