It is used in three key applications, including cooling or heating: 1) Objects directly on the cold plate, or objects on an additional cold plate of your own design; 2) Enclosures by attaching a thermal conductive container to the cold plate; 3) Liquids by attaching a thermal conductive tank or liquid heat sink to the cold plate. The heat is absorbed by the cold plate, pumped through the TE modules and then dissipated to the air by an air heat sink. It delivers compact and reliable cooling. Typical applications include cooling electrical devices, analytical instruments, lasers and commercial refrigeration.
This product is a cooling assembly that provides cooling and heat dissipation by directly contacting the cold plate with the cooling object. The heat is then removed from the hot end through forced air cooling. It is widely used in beauty and medical equipment as well as laser devices. It is characterized by its compact design, small size, and high reliability.
By adopting semiconductor cooling technology, the product's cooling efficiency has been greatly improved.
Good Sealing Effect
Our thermoelectric cooler assemblies feature excellent sealing performance to prevent air leakage, ensuring reliable and stable operation in various environments.
Modular Design
The modular design of our thermoelectric cooler assemblies provides flexibility for customization and easy maintenance, allowing for quick and efficient replacement of parts if needed.
Compact Structure
With a compact structure, our thermoelectric cooler assemblies are space-saving and easy to integrate into different systems or devices, providing efficient temperature control in limited spaces.
