It is used to cool or heat either objects attached directly to the coldplate, or enclosures by attaching a thermal conductive container tothe cold plate. Heat is dissipated to a liquid on the warm side. Theliquid circuit is normally of a circulating type with a pump and aLiquid-to-Air heat exchanger removing the heat into the ambient air.By using an efficient heat exchanger and one or more Plate to LiquidAssemblies a very powerful yet compact system is created. Ourstandard assemblies are optimized for high cooling capacity andefficiency rather than maximum AT Typical applications includetemperature cycling of electronic components, laser cooling andanalytical instruments.
The TE05-40XXEL uses semiconductor cooling technology and liquid-cooled forced convection heat transfer method to heat and cool the cold plate, and through heat conduction, the cooled objects such as those attached to the side of the cold plate can achieve the effect of increasing and decreasing of temperature. Widely used in medical, beauty and industrial laser equipment and other fields.
By adopting semiconductor cooling technology, the product's cooling efficiency has been greatly improved.
Good Sealing Effect
Our thermoelectric cooler assemblies feature excellent sealing performance to prevent air leakage, ensuring reliable and stable operation in various environments.
Modular Design
The modular design of our thermoelectric cooler assemblies provides flexibility for customization and easy maintenance, allowing for quick and efficient replacement of parts if needed.
Compact Structure
With a compact structure, our thermoelectric cooler assemblies are space-saving and easy to integrate into different systems or devices, providing efficient temperature control in limited spaces.