Plate to Liquid

Plate to Liquid

It is used to cool or heat either objects attached directly to the coldplate, or enclosures by attaching a thermal conductive container tothe cold plate. Heat is dissipated to a liquid on the warm side. Theliquid circuit is normally of a circulating type with a pump and aLiquid-to-Air heat exchanger removing the heat into the ambient air.By using an efficient heat exchanger and one or more Plate to LiquidAssemblies a very powerful yet compact system is created. Ourstandard assemblies are optimized for high cooling capacity andefficiency rather than maximum AT Typical applications includetemperature cycling of electronic components, laser cooling andanalytical instruments.

Model

TE81-200XFL

TE81-200XFL
TE81-200XFL

Description

The thermoelectric Cooler Assembly of this product provides refrigeration and heat dissipation by directly contacting the cold plate with the cooling pair. The heat is then carried away through a liquid circulation for heat exchange at the hot end. It is widely used in beauty and medical equipment, as well as laser devices. Its compact design, small size, and high reliability are its key features.

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Features

■Economical general use thermoelectric cooler (high performance and quality but economical)

■Thermoelectric Cooler(TEC: Peltier module) with high ΔTmax, large heat absorption, and high efficiency

■Special original products, such as one with a center hole

■Long life time with break-proof structure

■Production for custom made Thermoelectric Coolers to meet our customers purposes is possible

custom made
High Efficiency and Energy Saving

High Efficiency and Energy Saving

By adopting semiconductor cooling technology, the product's cooling efficiency has been greatly improved.

Good Sealing Effect

Good Sealing Effect

Our thermoelectric cooler assemblies feature excellent sealing performance to prevent air leakage, ensuring reliable and stable operation in various environments.

Modular Design

Modular Design

The modular design of our thermoelectric cooler assemblies provides flexibility for customization and easy maintenance, allowing for quick and efficient replacement of parts if needed.

Compact Structure

Compact Structure

With a compact structure, our thermoelectric cooler assemblies are space-saving and easy to integrate into different systems or devices, providing efficient temperature control in limited spaces.

Applications

Parameters

  • Model:

    TE81-200XFL

    Operating Voltage(V):

    12VDC

    Operating Current(A)

    19.0A/20.0A

    Cooling Capacity(W)

    209W
  • Heat Exchange Medium

    Deionized Water

    Dimensions(mm,L x W x H)

    170X95X148mm

    Operating Temperature(℃)

    5℃~40℃

    Operating Humidity(%)

    15%~80%
  • Storage Temperature(%)

    -20℃~60℃

    Storage Humidity(%)

    15%~80%

    Net Weight(Kg)

    2.0Kg

Dimensions

TE81-200XFL
TE81-200XFL
TE81-200XFL
TE81-200XFL

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