Huajing Temperature Control: What are the applications of semiconductor refrigeration technology in medical instruments?

Release time: November 07, 2025

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Huajing Temperature Control: What are the applications of semiconductor refrigeration technology in medical instruments?

Applications of Semiconductor Refrigeration Technology in Medical Instruments


With the rapid development of medical engineering and the continuous advancement of modern medicine, a wide range of high-precision and sophisticated equipment has been introduced into various clinical disciplines in hospitals, gradually replacing traditional diagnostic and treatment methods. Examples include PCR amplifiers, fully automated biochemical analyzers, fully automated blood cell analyzers, incubators, and culture boxes.

 

All of these devices utilize semiconductor refrigeration technology. Semiconductor refrigeration technology, also known as thermoelectric refrigeration, primarily relies on the Peltier effect of thermoelectricity to achieve cooling. This technology represents a method of refrigeration that is both traditional and innovative. Although the thermoelectric effect was discovered in the early 19th century, it was not practically applied until the first half of the 20th century, except for the use of metal thermocouples in temperature measurement.

 

 After the 1950s, the adoption of semiconductor materials with superior thermoelectric properties significantly improved the efficiency of the thermoelectric effect, enabling semiconductor refrigeration to enter the realm of engineering practice. The semiconductor refrigeration modules developed and produced by Huajing Temperature Control are cooling devices composed of single or multiple semiconductor refrigeration chips connected in series or parallel. This technology, which emerged in the 1950s, lies at the intersection of refrigeration technology and semiconductor technology. Its working principle is as follows: when a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form a pair, and a direct current is applied to the circuit, energy transfer occurs.

 

 The current flowing from the N-type semiconductor to the P-type semiconductor absorbs heat at the junction, creating a cold side, while the current flowing from the P-type semiconductor to the N-type semiconductor releases heat at the junction, creating a hot side. The amount of heat absorption and release depends on the magnitude of the current and the number of N and P semiconductor element pairs. As illustrated, the commonly used materials are ternary solid solution alloys based on bismuth telluride, with P-type being Bi₂Te₃-Sb₂Te₃ and N-type being Bi₂Te₃-Bi₂Se₃.




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